Optical wafer defect inspection at the 10 nm technology node and beyond

Defect inspection scientists from Huazhong University of Science and Technology, Harbin Institute of Technology and The Chinese University of Hong Kong make a thorough review of new perspectives and exciting trends on the foundation of former great reviews in the field of defect inspection methods. The review focuses on three specific areas: (1) the defect detectability evaluation, (2) the diverse optical inspection systems, and (3) the post-processing algorithms.